Details
Thermal Grizzly's AM5 High Performance Heatspreader (HPHS) is an upgrade heatspreader for delidded AMD Ryzen 7000 and Ryzen 9000 processors. It replaces the SAM and heatspreader, so it is only for delidded CPUs! On an Intel CPU? The Intel version is here.
Properties
- Socket type
- AMD AM5, delidded CPUs only
- Material
- Nickel-plated copper
- Color
- Silver nickel-plated
- Surface area
- 240% larger than stock (22 cm²)
- Size
- 70 x 53 x 6.0 mm
- Weight
- 103 g, 136 g boxed
A larger, diamond-milled surface
The heatspreader is made of nickel-plated copper and features a precision diamond milled surface that is 240 percent larger than the one on the original heatspreader. Thermal Grizzly says this increased surface area over the original allows for maximum heat dissipation. The precision milling ensures extremely low surface roughness for best contact with the heat sink, while the part stays compatible with air and water coolers. SAM stands for Socket Actuation Mechanism, a part of the motherboard.
In Thermal Grizzly's own test, an AMD Ryzen 7900X at 5.0 GHz and 1.3 vCore under a 280 mm AiO reached about 90 °C with the stock heatspreader. With this one it stayed below 80 °C. Thermal Grizzly calls those values guidelines: results depend on the individual processor, the room temperature and the cooling used.
Thermal paste and liquid metal
Traditional thermal pastes and gallium-based liquid metals are both compatible with the nickel-plated surface. The nickel forms a barrier layer between the liquid metal and the copper cooler: liquid metal does not diffuse into the copper, and alloying is minimized. As a result, Thermal Grizzly says, multiple applications of liquid metal are generally not necessary. For the best possible temperatures under load it recommends liquid metal, such as Conductonaut, as the thermal interface (TIM) between the CPU and the heatspreader.
Note on KryoSheet, Carbonaut and Kapton sheets
Thermal Grizzly's current product page warns about thermal sheets in this spot. The internal contour of the HPHS is optimized for liquid metal, which can be applied in a very thin layer, and the HPHS rests directly on the CPU package (PCB). With thermal sheets such as Carbonaut and KryoSheet between the CPU die and the HPHS, the small height difference may put excessive mounting pressure on the CPU. This can cause operational issues, which may include incorrect memory detection or memory instability. With Kapton Insulation Sheets there is a risk that the HPHS rests on the sheet and the CPU die does not make contact. To insulate the electronic components on the CPU package, the page asks for a thin layer of TG Shield.
The data sheet linked below is older. It still describes a KryoSheet graphene thermal pad as the way to the most maintenance-free system possible, with the included cover (the insulation sheet) to protect the electronic components, since KryoSheet pads are electrically conductive. The note above is the newer of the two, so go by the note.
Note on cooler compatibility
The HPHS is thinner compared to the stock AMD heatspreader. This means that its surface is approximately 2 millimeters lower, and depending on the cooler's mounting kit this might result in the CPU cooler not making contact with it. Before retrofitting and powering on, we recommend verifying whether the CPU cooler can be mounted 2 mm lower in the Z-height from the motherboard. If the cooler's mounting kit does not allow for a deeper installation, the AM5 Adapter & Offset Mounting Kit can provide a solution. For mono blocks, the mounting height and the heat transfer pads may need to be adjusted.
Compatibility note
- COMPATIBLE with the CPUs of the Ryzen 9000 series, including the X3D variant (as of March 2025).
- NOT COMPATIBLE with the APUs of the Ryzen 8000G series.
- As of May 2026, Thermal Grizzly's page adds the X3D2 variants, and the Ryzen 5 7400F for the version produced from 2026 onward.
Production changes
In August 2024, the nickel plating process was updated. Heatspreaders produced after this date are slightly duller, and the copper may show through due to the thinner nickel layer. However, Thermal Grizzly states that the thermal conductivity of the heat spreader has been improved by up to 5 degrees Celsius. Starting with the 2026 production year, a revised process results in matte areas as well as polished high-gloss contact surfaces. The high-gloss areas on the bottom indicate the contact zones for applying liquid metal.
Fitting it
Remove the SAM mounting screws and the SAM, protect the socket pins, and install the Ryzen CPU without its heatspreader. Apply the thermal paste or liquid metal to the CPU's chiplets. With liquid metal, the manual recommends an additional application on the matching contact surfaces of the heatspreader. Position the HPHS with the notch on the inner edge of the bottom facing up in the standard socket orientation (pin A1 top left). Screw it to the AM5 mounting plate with the included screws, hand-tight and crosswise. For delidding the processor Thermal Grizzly recommends the Ryzen 7000 Delid-Die-Mate.
Attention: delidding and warranty
- Removing the heatspreader ("delidding") of a processor is at your own risk!
- The manufacturer's warranty expires when the CPU is delidded, and damage caused by delidding the CPU is not covered by it.
- Removing the SAM may also invalidate the manufacturer's warranty of the mainboard manufacturer.
In the box
- 1x AM5 heatspreader
- 1x insulation sheet
- 4x pan-head screws, UNC thread 1/4"
- 1x hexagon socket wrench 5/64"
- 1x angle wrench Torx T20
Thermal Grizzly's manual and data sheet are both PDFs.
