Thermal putty interface is a high-performance, moldable thermal material designed to fill gaps between heat-generating components and heatsinks or cooling solutions. Offering superior thermal conductivity and flexibility, it conforms to uneven surfaces for maximum heat transfer and efficient dissipation. Ideal for GPUs, CPUs, power modules, and other high-performance electronics, thermal putty provides long-term stability, low thermal resistance, and ease of application without the mess of traditional thermal pastes. Its non-curing, reusable nature ensures consistent performance, making it an essential solution for advanced cooling applications.