2.0mm thermal pads provide exceptional heat transfer and gap-filling capabilities for efficient cooling in high-performance electronics. Made from thermally conductive silicone or graphite, these pads conform to uneven surfaces, ensuring optimal contact between components and heatsinks. Their thicker profile is ideal for applications requiring larger gap coverage, such as GPUs, CPUs, VRMs, and power modules. Offering easy application, electrical insulation, and long-term durability, 2.0mm thermal pads deliver a mess-free, reliable cooling solution for demanding systems and high-temperature environments.