ModMyMods MP-9 ModPaste Electronics Thermal Compound - 2.5g (MOD-0317)

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ModMyMods MP-9 ModPaste Electronics Thermal Compound - 2.5g (MOD-0317)

Availability: In stock - Available Now

Sku: MOD-0317

$11.99

Quick Overview

Low Conductivity Non Silicone Based Thermal Compound


Impressive Three Year Shelf Life!


Borosilicate Glass Syringe and Removable Applicator Tip makes re-using this thermal compound a breeze!


Easily stored inside its hard plastic case with magnetic lid to help your modding bench stay organized!

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Details

Sick of using a thermal compound that lacks a proclivity for heat conductivity?

ModMyMods has developed a brand new thermal compound made right here in the USA with international materials! While most thermal compounds are derived from a primarily ceramic, metallic base or silicone. We have developed an effective synthetic industrial oil based compound that is far less electrically conductive while still maintaining a highly effective heat transference between a chip and heatsink/waterblock.

The ModMyMods MP-9 Modpaste comes packaged in a rubber capped borosilicate glass syringe that boasts an impressive three year shelf life, removable, reusable applicator tip and a magnetically closed carrying case.

Also included with the MP-9 Modpaste are several rubber fingercots for easy, even application of your thermal compound across your chips!

Average of 15 applications - (Test surface - 38mm x 38mm)

Material Properties  
Form: Paste
Color: Grey
Odor:  Slight odor
pH:   6
Density:  2.6 g/cm3
Viscosity:  3,000 Pa.s at 22C
Thermal Conductivity:  9.0 W/mK
Constant Temperature Range:  50-200C

Additional Information

Amazon ASIN NA
NE CA Item # No
NE US Item # No
Manufacturer ModMyMods
Color Grey
TIM Type Paste
Contents 2.5gram/1.0ml
Thermal Conductivity 9 W/mk
Included 1x 1.0ml Borosilicate Glass Syringe filled with ModMyMods MP-9 ModPaste Electronics Thermal Compound 1x 14Ga Blunt Application Needle Tip 1x Hard Cover Carrying Case with Magnetic Lid 4x Latex Rubber Fingertip Cot (Under protective foam)
Material N/A

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