Details
Alphacool's double-sided adhesive core thermal pad can be used to cool electronic components of all kinds where it is important to effectively dissipate waste heat. This significantly improves the performance and durability of the components. The assembly is significantly simplified by the material-related stickiness.
Flexible and powerful
The thermal pad is reliable and powerful due to its material composition. With its low thickness, it offers a wide range of possible applications. It can be flexibly tailored to meet individual needs. Due to the adhesive nature, an effortless assembly of electrical components such as DDR modules, motherboard components or power supplies is possible.
Technical specifications | |
Dimensions (L x W x H) | 100x100x0.25mm |
Thermal Conductivity (ASTM D5470) | 1 W/mK ±10% |
Thickness (ASTM D374) | 0.25mm |
structure | fiberglass fabric |
Continuous operating temperature | -30~+120℃ |
Short-term operation temperature (30 seconds) | 180℃ |
Density (ASTM D792) | 1.2 g/cc |
Holding Force (PSTC-7) | >3000 minutes |
180° peel adhesion (aluminum) (PSTC-101) | >16N / 25mm |
dielectric breakdown voltage | 3KV ±10% |
Thermal Impedance @10psi (ASTM D5470) | 1.26 C-in² / W |
Thermal Impedance @30psi (ASTM D5470) | 1.06 C-in² / W |
Thermal Impedance @50psi (ASTM D5470) | 1.05 C-in² / W |
Color | white |
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Additional Information
Manufacturer | Alphacool |
---|---|
Overall Dimensions | 100x100x0.25mm |
Thermal Conductivity | 1W/mK |
Pad Thickness | 0.25mm |
Color | White |
Included | Alphacool Core Double Sided Adhesive Thermal Pad - 100x100x0.25mm |
Material | No |