The patent-pending Skylake-X Direct Die Frame of the OC champion der8auer is a new masterpiece of German engineering. The CPU mounting frame replaces the complete Intel ILM (Integrated Loading Mechanism) including mounting holes for the CPU cooler. With this inconspicuous component, extreme overclockers open up completely new possibilities for professionally balancing their CPUs, which provide amazing overclocking results with commercially available CPU coolers as well as liquid nitrogen cooling systems.

The der8auer Skylake-X Direct Die Frame at a glance:

• Practical tool for CPU use without heatspreader
• Safe assembly to maximize cooling performance
• Compatible with current Socket 2066 motherboards
• Made of high-quality aluminum in anodized black

Overclocking to the limit

Since 2004, Intel has been using so-called LGA sockets (Land Grid Array) as a connection system to attach its processors to the respective motherboards. Since then, the latter have housed the connector pins previously mounted on the underside of the CPU and, unlike AMD processors with PGA technology (Pin Grid Array), only flat contact surfaces can be found on Intel CPUs since then. So that an Intel processor can still be securely fixed in the socket, it is clamped via the integrated heatspreader (IHS) through a folding frame.
When delivered, this nickel-plated copper heatspreader forwards the chip's waste heat to the CPU cooler and distributes the thermal energy over a larger contact surface than that provided by the pure silicon
itself. However, to connect both components, there is a thermal interface material (TIM) between the heatspreader and the silicon chip. This standard thermal compound has a relatively low thermal conductivity, especially on Intel processors, and is overwhelmed with heat dissension with heavy overclocking.
In this case, it does not matter how powerful the CPU cooling is, since the heat accumulation already takes place inside the processor
package. So that such a CPU can be sufficiently cooled even with pronounced overclocking, enthusiasts simply separate the heatspreader with the der8auer Delid-Die-Mate X, replace the thermal paste with liquid metal and then mount the heatspreader again. As a result, the temperature of an Intel Skylake-X processor can already be lowered by 10-20 °C. With the Skylake-X Direct Die Frame, the two additional layers of heatspreader and thermal paste are no longer needed, which can reduce the temperature by another 5-10 °C. As a result, the CPU can be overclocked much better.
The outer edge of the der8auer Skylake-X Direct The Frame is only about 0.1 mm below the silicon chip itself, which effectively protects the latter from tilting the CPU cooler and thus from
damage. The black anodized layer also insulates the aluminum of the Direct Die frame, which means that it is no longer electrically conductive. The SK-X DDF can thus rest safely on the upper contacts of the CPU. For mounting, the socket holder (Retention Module) of the Intel socket must be removed. Then the included backplate is attached to the back of the motherboard with adhesive pads, the CPU is inserted and the frame is fastened from above with four screws. The SK-X DDF is manufactured according to extremely tight tolerances, so that it rests evenly on the board. This ensures that the contact between the motherboard and the CPU is completely established and that all devices, such as PCIe cards or RAM bars, are properly recognized.

German Engineered Perfection - Developed by overclocking world champion der8auer

Roman "der8auer" Hartung (pronounced: "the farmer") is a graduated mechatronics engineer (B.Eng.), hardware enthusiast and professional overclocker from Germany. Despite his comparatively tender age, he has been active in the extreme overclocking scene for many years and has already set countless groundbreaking world records during this time. Always interested in teasing out even the last drop of performance from any high-end hardware, the OC grandmaster currently occupies (as of August 2015) the second place in the professional "elite" ranking of the best overclockers in the world (on HWBot.org). At Caseking, der8auer offers a range of exclusive OC products that allow home users to enjoy breathtaking peak performance, such as massively overclocked extreme gaming systems for enthusiasts and overclocking bundles or self-developed LN2/DICE containers for liquid nitrogen or dry ice cooling.




*** Important warning! *** The removal of the CPU heatspreader is at your own risk and is always accompanied by the complete loss of the manufacturer's warranty and warranty! Compatibility note: Without the integrated heatspreader, the mounting height of the CPU cooler is slightly reduced, which is why those with an unchangeable mounting height can no longer be mounted.
Therefore, before mounting, be sure to check whether the cooler to be used can also be used at a lower mounting height. Compatibility is guaranteed with all water coolers from EKWB and Aquacomputer as well as the AiO water cooling systems from Corsair and NZXT. The Skylake-X Direct Frame is not compatible with motherboard monoblocks.

details:

• Type: CPU mounting frame
• Material: anodized aluminum
• Color: Black
• Compatible with all Socket 2066 motherboards
• Compatible with all Intel Skylake-X processors
• Scope
  
  of supply: 1x Direct
  
  The
  
  Frame 1x
  
  Backplate 4x M3 Screws 1x Hexagon key
  
  1x Torx key
  
  1x plastic spatula